The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Jun. 01, 2015
Applicant:

Shengyi Technology Co., Ltd., Dongguan, Guangdong, CN;

Inventors:

Xianping Zeng, Dongguan, CN;

Liexiang He, Dongguan, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 63/04 (2006.01); C08G 59/62 (2006.01); C08G 59/42 (2006.01); C08J 5/24 (2006.01); C08J 5/04 (2006.01); C08J 5/10 (2006.01); C08G 59/68 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); C08G 59/4238 (2013.01); C08G 59/4284 (2013.01); C08G 59/621 (2013.01); C08G 59/685 (2013.01); C08G 59/686 (2013.01); C08J 5/043 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); H05K 1/0373 (2013.01); C08J 2363/04 (2013.01); C08J 2425/08 (2013.01); C08J 2461/14 (2013.01); C08L 2201/02 (2013.01); C08L 2201/22 (2013.01); C08L 2203/20 (2013.01); C08L 2205/05 (2013.01);
Abstract

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.


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