The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jan. 15, 2016
Tyco Electronics Corporation, Berwyn, PA (US);
Sandeep Patel, Middletown, PA (US);
Bruce Allen Champion, Camp Hill, PA (US);
Linda Ellen Shields, Camp Hill, PA (US);
Michael John Phillips, Camp Hill, PA (US);
Thomas Taake de Boer, Hummelstown, PA (US);
John Joseph Consoli, Harrisburg, PA (US);
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Abstract
An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.