The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

May. 12, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Wanxun He, Singapore, SG;

Su Xing, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 47/00 (2006.01); H01L 27/11 (2006.01); H01L 23/48 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01); H01L 23/525 (2006.01); H01L 23/532 (2006.01); G11C 14/00 (2006.01); G11C 11/419 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1116 (2013.01); G11C 11/419 (2013.01); G11C 14/009 (2013.01); H01L 23/481 (2013.01); H01L 23/525 (2013.01); H01L 23/532 (2013.01); H01L 27/1104 (2013.01); H01L 27/2463 (2013.01); H01L 45/06 (2013.01); H01L 45/1233 (2013.01); H01L 45/143 (2013.01); H01L 45/144 (2013.01);
Abstract

A static random access memory device includes two body contacts and two resistive-switching devices. The body contacts are disposed in a wafer and are exposed from a back side of the wafer, wherein the body contacts electrically connect a static random access memory cell through a metal interconnect in the wafer. The resistive-switching devices connect the two body contacts respectively from the back side of the wafer. A method of forming a static random access memory device is also provided in the following. A wafer having two body contacts exposed from a back side of the wafer and a metal interconnect electrically connecting a static random access memory cell to the body contacts is provided. Two resistive-switching devices are formed to connect the two body contacts respectively from the back side of the wafer.


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