The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Feb. 08, 2016
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Jae Yun Kim, Seoul, KR;
Tae Kyung Hwang, Seoul, KR;
Jin Han Kim, Gyeonggi-do, KR;
Jong Sik Paek, Incheon, KR;
Kyoung Rock Kim, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
Jae Beum Shim, Incheon, KR;
Assignee:
Amkor Technology, Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/3114 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/18162 (2013.01);
Abstract
A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.