The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Mar. 09, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chia-Hsin Hu, Changhua County, TW;

Sun-Jay Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/8234 (2006.01); H01L 21/762 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/76224 (2013.01); H01L 21/76229 (2013.01); H01L 21/823412 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 28/40 (2013.01); H01L 29/0653 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A semiconductor structure comprises a semiconductor substrate and a shallow trench isolation (STI) feature over the substrate. The STI feature includes first and second portions. A top surface of the first portion is lower than a top surface of the second portion. The semiconductor structure further comprises fin active regions; conductive features on the fin active regions and the STI feature; and dielectric features separating the conductive features from the fin active regions. The semiconductor structure further comprises a first gate stack having a first one of the dielectric features and a first one of the conductive features overlying the first one of the dielectric features; and a second gate stack having a second one of the dielectric features and a second one of the conductive features overlying the second one of the dielectric features.


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