The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Oct. 07, 2015
Applicant:
Xintec Inc., Taoyuan, TW;
Inventor:
Yu-Lung Huang, Taoyuan, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 27/146 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); B81B 7/007 (2013.01); B81C 1/00238 (2013.01); H01L 21/76898 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 24/45 (2013.01); H01L 24/83 (2013.01); H01L 2224/02335 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/038 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0556 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/92147 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/181 (2013.01);
Abstract
A chip package including a first substrate having an upper surface, a lower surface and a sidewall is provided. A sensing region or device region and a conducting pad are adjacent to the upper surface. A through-hole penetrates the first substrate. A redistribution layer extends from the lower surface into the through-hole and is electrically connected to the conducting pad. The redistribution layer further laterally extends from the lower surface to protrude from the sidewall. A method for forming the chip package is also provided.