The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Jan. 10, 2016
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Tzung-Han Lee, Taipei, TW;
Chun-Yi Wu, New Taipei, TW;
Sheng-Yu Yan, New Taipei, TW;
Yi-Ting Cheng, New Taipei, TW;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 21/7685 (2013.01); H01L 21/76892 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/06102 (2013.01); H01L 2924/2064 (2013.01);
Abstract
A wafer and a forming method thereof are provided. The wafer has a die region and a scribe-line region adjacent to the die region, and includes a conductive bonding pad in the die region of the wafer and a wafer acceptance test (WAT) pad in the scribe-line region of the wafer. A top surface of the WAT pad is lower than a top surface of the conductive bonding pad.