Method of contacting substrate with probe card

Abstract

A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe cardwhile being mounted on a chuck memberwith a wafer platetherebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe cardby moving the wafer W and the wafer platetoward the probe cardthrough an elevating device. Then, the wafer W is overdriven toward the probe cardand a contact state between the electrodes of the semiconductor devices and the probes of the probe cardis maintained by decompressing a space S between the probe cardand the wafer plate. Then, the chuck memberis separated from the wafer plate