The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Mar. 27, 2013
Mitsubishi Materials Corporation, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
To provide a power-module substrate and a manufacturing method thereof in which small voids are reduced at a bonded part and separation can be prevented. Bonding a metal plate of aluminum or aluminum alloy to at least one surface of a ceramic substrate by brazing, when a cross section of the metal plate is observed by a scanning electron microscope in a field of 3000 magnifications in a depth extent of 5 μm from a bonded interface between the metal plate and the ceramic substrate in a width area of 200 μm from a side edge of the metal plate, residual-continuous oxide existing continuously by 2 μm or more along the bonded interface has total length of 70% or less with respect to a length of the field.