The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Sep. 22, 2016
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Yu-Chung Hsieh, Taoyuan, TW;
Chun-Hsien Chien, Taoyuan, TW;
Wei-Ti Lin, Taoyuan, TW;
Yu-Hua Chen, Hsinchu, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/0271 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/068 (2013.01);
Abstract
A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.