The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Oct. 13, 2016
Applicants:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
National Chiao-tung University, Hsinchu, TW;
Inventors:
Chao-Hsin Chien, Hsinchu, TW;
Chen-Han Chou, Hsinchu, TW;
Cheng-Ting Chung, Hsinchu, TW;
Samuel C. Pan, Hsinchu, TW;
Assignees:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
National Chiao-Tung University, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/823431 (2013.01); H01L 27/0207 (2013.01); H01L 29/0657 (2013.01); H01L 29/0847 (2013.01); H01L 29/42356 (2013.01); H01L 29/7853 (2013.01);
Abstract
A semiconductor device including at least one fin disposed on a surface of a semiconductor substrate is provided. The fin includes a main portion extending along a first direction, and at least one secondary portion extending outward from the main portion along a second direction not collinear with the first direction.