The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jan. 18, 2017
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Honami Nawa, Osaka, JP;
Hirohisa Hino, Osaka, JP;
Abstract
Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 μm to 150 μm; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.7 times longer than the total thickness of the water-based coating material of the water-based coating material layer and the thermosetting resin of the resin layer, as measured along the long axis through the center of gravity of the fillers.