The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jun. 29, 2016
Nexperia B.v.;
Hans-Martin Ritter, Hamburg, DE;
Frank Burmeister, Hamburg, DE;
Nexperia B.V., Eindhoven, NL;
Abstract
A method of making a plurality of semiconductor devices comprising a chip scale packages. The method includes providing a semiconductor wafer having a major surface and a backside. The method also includes forming a plurality of contacts on the major surface. The method further includes forming a plurality of trenches in the major surface of the substrate. The method also includes forming a plurality of openings in the wafer between the backside and the trenches in the major surface. The method further includes depositing an encapsulant on the backside of the wafer. At least some of the encapsulant passes through the openings in the wafer to at least partially fill the trenches in the major surface. The method also includes singulating the wafer to produce a plurality of chip scale packages having a major surface including one or more contacts and side walls at least partially covered with said encapsulant.