The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Oct. 20, 2014
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventor:

Matthew Davis, Felton, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/52 (2006.01); H01L 21/66 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); C23C 16/4401 (2013.01); C23C 16/52 (2013.01); H01J 37/3299 (2013.01); H01J 37/32853 (2013.01); H01J 37/32889 (2013.01); H01J 37/32935 (2013.01); H01L 22/12 (2013.01); H01L 22/24 (2013.01);
Abstract

Apparatuses and methods for improved substrate defect detection is provided. Substrate defects may be detected, possibly with defect detection equipment such as laser metrology equipment. Defects smaller than the detection limit of the detection equipment may be decorated with a layer of material to increase the effective sizes of the defects. The thickness and composition of the material deposited may be tuned depending on the composition of the substrate and the defects. The composition of the detected defects may be identified with defect identification equipment. The defect identification equipment may be an electron generating apparatus and the composition of the defects may be identified from the interaction of the electrons with the defect. The deposited material may be removed either before or during the defect identification phase to aid in the identification of the defect composition.


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