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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9857689 B1

PDFFull Text
Date of Patent:
Jan. 02, 2018

Filed:

Jun. 22, 2016

Method for fabricating pattern using supporting assembly with rolling member disposed below supporting rods and semiconductor fabrication apparatus having the supporting assembly

Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chien-Ju Wu, Chiayi County, TW;

Ming-Sung Wu, Tainan, TW;

Assignee:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Attorney:

Winston Hsu

Primary Examiner:

Colin Kreutzer

Int. Cl.
CPC ...
G03B 27/54 (2006.01); G03B 27/58 (2006.01); G03B 27/62 (2006.01); H02K 41/02 (2006.01); G03F 7/20 (2006.01); H01L 21/308 (2006.01); F16L 3/10 (2006.01); F16L 3/01 (2006.01); F16L 3/223 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2041 (2013.01); F16L 3/01 (2013.01); F16L 3/10 (2013.01); F16L 3/2235 (2013.01); G03F 7/709 (2013.01); G03F 7/70341 (2013.01); G03F 7/70816 (2013.01); G03F 7/70825 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/3086 (2013.01);
Abstract

A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.

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