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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9857687 B1

PDFFull Text
Date of Patent:
Jan. 02, 2018

Filed:

Feb. 26, 2014

Method of manufacturing substrate and substrate and mask film

Applicants:

Tokai Shinei Electronics Industry Co., Ltd, Gifu, JP;

Tadayoshi Saito, Kanagawa, JP;

Yamatoya & Co., Ltd, Tokyo, JP;

Inventors:

Kazunori Tsuge, Ena, JP;

Yoshihito Tanaka, Ena, JP;

Koji Akiyama, Ena, JP;

Kiyoshi Tanaka, Ena, JP;

Kazuyoshi Nishio, Ena, JP;

Takehiro Kato, Ena, JP;

Masaru Murakami, Ena, JP;

Tadayoshi Saito, Yokohama, JP;

Hirotoshi Yoshimura, Tokyo, JP;

Akira Inoue, Tokyo, JP;

Iwao Numakura, Tokyo, JP;

Noriaki Tsukada, Tokyo, JP;

Assignees:

TOKAI SHINEI ELECTRONICS INIDUSTRY CO., LTD, Gifu, JP;

Other;

YAMATOYA & CO., LTD, Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/09 (2006.01); G03C 1/76 (2006.01); G03C 1/95 (2006.01); G03F 7/20 (2006.01); G03F 7/11 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); G03F 1/50 (2012.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2002 (2013.01); G03C 1/76 (2013.01); G03C 1/95 (2013.01); G03F 1/50 (2013.01); G03F 7/11 (2013.01); G03F 7/2022 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); H01L 23/49894 (2013.01); H05K 1/0269 (2013.01); H05K 3/287 (2013.01); H01L 2924/0002 (2013.01); H05K 3/341 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09936 (2013.01); H05K 2203/056 (2013.01); H05K 2203/0571 (2013.01);
Abstract

A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

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