The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Apr. 30, 2015
Applicants:

Xyzprinting, Inc., New Taipei, TW;

Kinpo Electronics, Inc., New Taipei, TW;

Cal-comp Electronics & Communications Company Limited, New Taipei, TW;

Inventors:

Shih-Jer Din, New Taipei, TW;

Ming-Chih Huang, New Taipei, TW;

Chien-Ying Tseng, New Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B28B 1/00 (2006.01); B22F 3/03 (2006.01); B33Y 30/00 (2015.01); B29C 64/218 (2017.01); B33Y 40/00 (2015.01); B29K 101/00 (2006.01); B29K 105/00 (2006.01); B22F 3/105 (2006.01); B29C 64/20 (2017.01); B29C 64/165 (2017.01); B29C 64/153 (2017.01);
U.S. Cl.
CPC ...
B29C 67/0074 (2013.01); B22F 3/03 (2013.01); B28B 1/001 (2013.01); B29C 64/218 (2017.08); B29C 67/0081 (2013.01); B29C 67/0085 (2013.01); B29C 67/0096 (2013.01); B33Y 30/00 (2014.12); B22F 2003/1056 (2013.01); B22F 2003/1059 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/20 (2017.08); B29K 2101/00 (2013.01); B29K 2105/251 (2013.01); B33Y 40/00 (2014.12);
Abstract

A 3-D printing apparatus including a base and a printing head module is provided. The base includes a first supplying platform, a printing bed and a second supplying platform disposed in order along a printing path. The first supplying platform and the second supplying platform carry building powder respectively; the first supplying platform and the second supplying platform are alternately lifted to a printing-reference plane of the base for supplying the building powder to the printing bed. The printing head module is movably disposed above the base and configured to move along a forward direction of the print path to transfer the building powder of the first supplying platform onto the printing bed, and move along a backward direction of the printing path to transfer building powder of the second supplying platform onto the printing bed to form bonded powder layers stacked together to form a 3-D object.


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