The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jan. 19, 2017
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Wei-Ti Lin, Taoyuan, TW;

Chun-Hsien Chien, Taoyuan, TW;

Yu-Chung Hsieh, Taoyuan, TW;

Yu-Hua Chen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/40 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H05K 1/165 (2013.01); H05K 3/4076 (2013.01); H05K 3/42 (2013.01); H05K 3/423 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/086 (2013.01);
Abstract

A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.


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