The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jun. 06, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Kuan-Ti Wang, Kaohsiung, TW;

Ling-Chun Chou, Yun-Lin County, TW;

Kun-Hsien Lee, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 27/06 (2006.01); H01L 21/8238 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0617 (2013.01); H01L 21/82385 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 21/823864 (2013.01); H01L 21/823878 (2013.01); H01L 21/82345 (2013.01); H01L 29/4236 (2013.01); H01L 29/66621 (2013.01); H01L 29/785 (2013.01); H01L 29/7816 (2013.01);
Abstract

A method for fabricating semiconductor device includes the steps of: forming a first fin-shaped structure on a substrate; forming a shallow trench isolation (STI) adjacent to the first fin-shaped structure; and forming a gate structure on the first fin-shaped structure and the STI. Preferably, the gate structure comprises a left portion and the right portion and the work functions in the left portion and the right portion are different.


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