The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Nov. 06, 2016
Applicant:
Nexperia B.v., Eindhoven, NL;
Inventors:
Xue Ke, Kwai Chung, HK;
Kan Wae Lam, Kwai Chung, HK;
Sven Walczyk, Nijmegan, NL;
Wai Keung Ho, Kwai Chung, HK;
Wing Onn Chaw, Seremban, MY;
Assignee:
Nexperia B.V., Eindhoven, NL;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 23/4951 (2013.01); H01L 23/49582 (2013.01); H01L 23/49805 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01);
Abstract
A semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate.