The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Nov. 05, 2014
Applicant:
Sandisk Technologies Llc, Plano, TX (US);
Inventors:
Yuji Takahashi, Yokkaichi, JP;
Takuya Futase, Nagoya, JP;
Noritaka Fukuo, Yokkaichi, JP;
Katsuo Yamada, Yokkaichi, JP;
Tomoyasu Kakegawa, Yokkaichi, JP;
Assignee:
SANDISK TECHNOLOGIES LLC, Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 27/1157 (2017.01); H01L 27/11524 (2017.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/0217 (2013.01); H01L 21/02266 (2013.01); H01L 21/76802 (2013.01); H01L 21/76829 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A stack of layers is formed that includes first, second, and third dielectric layers. Contact plugs are then formed extending through the stack. Then a fourth dielectric layer is formed over the stack and contact plugs and trenches are formed through the fourth and third dielectric layers, extending to the second dielectric layer and exposing contact plugs.