The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

May. 13, 2015
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:

Chak Tong Sze, Kwai Chung, HK;

Pei Wei Tsai, Kwai Chung, HK;

Cho Hin Cheuk, Kwai Chung, HK;

Si Ming Chan, Kwai Chung, HK;

Kam Sing Lee, Kwai Chung, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2896 (2013.01); G01R 1/0425 (2013.01); G01R 1/0466 (2013.01);
Abstract

A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.


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