The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Mar. 17, 2015
Honeywell International Inc., Morristown, NJ (US);
Cornell University, Ithaca, NY (US);
Steven Tin, Plymouth, MN (US);
Jeffrey James Kriz, Eden Prairie, MN (US);
Steven J. Eickhoff, Brooklyn Park, MN (US);
Jeff A. Ridley, Shorewood, MN (US);
Amit Lal, Ithaca, NY (US);
Christopher Ober, Ithaca, NY (US);
Serhan Ardanuc, Ithaca, NY (US);
Ved Gund, Ithaca, NY (US);
Alex Ruyack, Ithaca, NY (US);
Katherine Camera, Ithaca, NY (US);
Honeywell International Inc., Morris Plains, NJ (US);
Abstract
Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.