The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Jun. 13, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chun-Lin Fang, Tainan, TW;
Ping-Hao Lin, Tainan, TW;
Ching-Hua Chu, Kaohsiung, TW;
Hsiao-Chun Lee, Chiayi, TW;
Chi-Feng Huang, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a substrate and a through substrate via structure. The substrate has a through via hole. The through substrate via structure is disposed in the through via hole. The through substrate via structure disposed in the through via hole includes a liner structure and a metal layer. The liner structure includes at least two insulation liners and at least one conductive shielding layer disposed between the insulation liners, in which the insulation liners and the at least one conductive shielding layer conformally cover a sidewall and a bottom of the through via hole. The metal layer covers the liner structure and fills the through via hole.