The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

May. 02, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mehran Behdjat, San Jose, CA (US);

Norman L. Tam, Cupertino, CA (US);

Aaron Muir Hunter, Santa Cruz, CA (US);

Joseph M. Ranish, San Jose, CA (US);

Koji Nakanishi, Sumida-Ku, JP;

Toshiyuki Nakagawa, Narti, JP;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); C23C 16/50 (2013.01); H01L 21/67115 (2013.01); H01L 21/68735 (2013.01); H01L 2221/683 (2013.01);
Abstract

A support ring for semiconductor processing is provided. The support ring includes a ring shaped body defined by an inner edge and an outer edge. The inner edge and outer edge are concentric about a central axis. The ring shaped body further includes a first side, a second side, and a raised annular shoulder extending from the first side of the ring shaped body at the inner edge. The support ring also includes a coating on the first side. The coating has an inner region of reduced thickness region abutting the raised annular shoulder.


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