The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Dec. 21, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Mondira D. Pant, Westborough, MA (US);

Mohamed A. Abdelmoneum, Portland, OR (US);

Tanay Karnik, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H04L 9/32 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G01N 29/2406 (2013.01); G06K 9/00087 (2013.01); G06K 9/00885 (2013.01); G06K 9/00892 (2013.01); H04L 9/3231 (2013.01); G06K 2009/00932 (2013.01);
Abstract

An embodiment includes an ultrasonic sensor system comprising: a backend material stack including a first metal layer between a substrate and a second metal layer with each of the first and second metal layers including a dielectric material; a ultrasonic sensor including a chamber, having a negative air pressure, that is sealed by first and second electrodes coupled to each other with first and second sidewalls; an interconnect, not included in the sensor, in the second metal layer; wherein (a) a first vertical axis intersects the substrate, the chamber, and the first and second electrodes, (b) a second vertical axis intersects the interconnect and the substrate, (c) a first horizontal axis intersects the chamber, the interconnect, and the first and second sidewalls, and (d) the first and second electrodes and the first and second sidewalls each include copper and each are included in the second metal layer.


Find Patent Forward Citations

Loading…