The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Mar. 21, 2014
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Hu Yang, Guangdong, CN;

Yueshan He, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/02 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); C08G 14/06 (2006.01); C08L 61/34 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08L 79/02 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/285 (2013.01); C08G 14/06 (2013.01); C08J 5/24 (2013.01); C08L 61/34 (2013.01); C08L 71/126 (2013.01); B32B 2264/102 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); C08J 2371/12 (2013.01); C08J 2379/02 (2013.01); C08J 2425/10 (2013.01); C08J 2471/12 (2013.01); C08L 2201/02 (2013.01); C08L 2201/22 (2013.01); C08L 2205/03 (2013.01); H05K 1/0373 (2013.01); H05K 3/022 (2013.01); H05K 2201/012 (2013.01);
Abstract

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.


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