The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Aug. 12, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Myung Sam Kang, Suwon-Si, KR;
Young Kwan Lee, Suwon-Si, KR;
Seung Eun Lee, Suwon-Si, KR;
Seung Yeop Kook, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 3/403 (2013.01); H05K 3/421 (2013.01); H05K 3/429 (2013.01); H05K 1/117 (2013.01); H05K 2203/072 (2013.01);
Abstract
There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.