The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Mar. 04, 2013
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Han-Chee Yen, Taipei, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01Q 9/04 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01Q 9/0407 (2013.01); H01L 21/561 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate.