The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jan. 28, 2016
Applicant:

D3 Semiconductor Llc, Addison, TX (US);

Inventor:

Thomas E. Harrington, III, Carrollton, TX (US);

Assignee:

D3 Semiconductor LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/28518 (2013.01); H01L 21/76805 (2013.01); H01L 21/76843 (2013.01); H01L 21/76889 (2013.01); H01L 21/76895 (2013.01); H01L 23/53266 (2013.01); H01L 29/0623 (2013.01); H01L 29/0634 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/66333 (2013.01); H01L 29/66712 (2013.01); H01L 29/7395 (2013.01); H01L 29/7811 (2013.01);
Abstract

A vertical drift metal-oxide-semiconductor (VDMOS) transistor with improved contact to source and body regions, and a method of fabricating the same. A masked ion implant of the source regions into opposite-type body regions defines the locations of body contact regions, which are implanted subsequently with a blanket implant. The surface of the source regions and body contact regions are silicide clad, and an overlying insulator layer deposited and planarized. Contact openings are formed through the planarized insulator layer, within which conductive plugs are formed to contact the metal silicide, and thus the source and body regions of the device. A metal conductor is formed overall to the desired thickness, and contacts the conductive plugs to provide bias to the source and body regions.


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