The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
May. 30, 2017
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Paul W. Sanders, Scottsdale, AZ (US);
Robert E. Jones, Colorado Springs, CO (US);
Michael F. Petras, Phoenix, AZ (US);
Chandrasekaram Ramiah, Phoenix, AZ (US);
Assignee:
INVENSAS CORPORATION, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/3675 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/58 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/162 (2013.01); H01L 25/50 (2013.01); H01L 27/0296 (2013.01); H01L 27/0629 (2013.01);
Abstract
Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates. An active device (AD) substrate has contacts on its upper portion. A ground plane is located between the AD substrate and an IPD substrate. The ground plane provides superior IPD to AD cross-talk attenuation.