The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Nov. 13, 2015
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Inventors:
Akihiko Nakamura, Kawasaki, JP;
Kimihiro Nakada, Kawasaki, JP;
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 38/00 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); B32B 37/18 (2006.01); B32B 7/12 (2006.01); B32B 38/10 (2006.01); H01L 21/56 (2006.01); B32B 37/26 (2006.01); B32B 37/12 (2006.01); B32B 7/06 (2006.01); B32B 9/04 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 3/02 (2006.01); B32B 3/08 (2006.01); B32B 3/10 (2006.01); B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/182 (2013.01); B32B 38/0012 (2013.01); H01L 21/4803 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); B32B 3/02 (2013.01); B32B 3/085 (2013.01); B32B 3/10 (2013.01); B32B 3/30 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/04 (2013.01); B32B 27/283 (2013.01); B32B 27/308 (2013.01); B32B 38/10 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/268 (2013.01); B32B 2038/0016 (2013.01); B32B 2250/44 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); H01L 21/568 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01);
Abstract
A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.