The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Jul. 14, 2014
Applicant:
Suss Microtec Lithography, Gmbh, Garching, DE;
Inventors:
Hale Johnson, Jericho, VT (US);
Gregory George, Colchester, VT (US);
Michael Brennen, Irasburg, VT (US);
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 31/28 (2006.01); H01L 21/683 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); H01L 21/67092 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); Y10T 279/23 (2015.01);
Abstract
A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.