The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jul. 08, 2013
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Suguru Sassa, Toyama, JP;

Shuhei Shigaki, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); C11D 11/00 (2006.01); H01L 21/67 (2006.01); C11D 3/04 (2006.01); C11D 3/43 (2006.01); C11D 7/08 (2006.01); C11D 7/50 (2006.01); C11D 3/20 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0041 (2013.01); C11D 3/042 (2013.01); C11D 3/2044 (2013.01); C11D 3/2068 (2013.01); C11D 3/2096 (2013.01); C11D 3/43 (2013.01); C11D 7/08 (2013.01); C11D 7/5004 (2013.01); C11D 11/0047 (2013.01); H01L 21/0206 (2013.01); H01L 21/31 (2013.01); H01L 21/6704 (2013.01);
Abstract

There is provided a cleaning fluid that effectively removes metal impurities and the like existing on a portion through which a chemical solution for lithography passes, before causing the chemical solution to pass through a semiconductor manufacturing equipment in a lithography process, in order to prevent defects caused by the metal impurities and the like found on a semiconductor substrate after forming a resist pattern or after processing a semiconductor substrate in a process for manufacturing semiconductor device. A cleaning fluid to clean a portion through which a chemical solution for lithography passes in a semiconductor manufacturing equipment used in a lithography process for manufacturing semiconductors, including: an inorganic acid; water; and a hydrophilic organic solvent. In the cleaning fluid, the concentration of the inorganic acid is preferably 0.0001% by mass to 60% by mass based on a total mass of the cleaning fluid.


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