The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Nov. 21, 2012
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Shuugo Yokota, Kiyosu, JP;

Yasuyuki Yamato, Kiyosu, JP;

Satoru Yarita, Kiyosu, JP;

Tomohiko Akatsuka, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/30625 (2013.01); H01L 29/20 (2013.01);
Abstract

A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains abrasive grains, an oxidizing agent, and a water-soluble polymer. When the polishing composition is left to stand for one day in an environment with a temperature of 25° C., the water-soluble polymer may be adsorbed on the abrasive grains at 5,000 or more molecules per 1 μmof the surface area of the abrasive grains. Alternatively, the water-soluble polymer may be a compound that reduces the water contact angle of the portion containing a group III-V compound material of the object after being polished with the polishing composition.


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