The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
May. 26, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Myung Sam Kang, Suwon-Si, KR;
Ki Jung Sung, Suwon-Si, KR;
Seung Yeop Kook, Suwon-Si, KR;
Seung Eun Lee, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/40 (2013.01); H05K 1/09 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/188 (2013.01); H05K 3/244 (2013.01); H05K 2203/049 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49156 (2015.01);
Abstract
Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.