The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Nov. 23, 2015
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

John K. Day, Chandler, AZ (US);

David A. Ruben, Mesa, AZ (US);

Michael S. Sandlin, Chandler, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 3/10 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 3/4611 (2013.01); H05K 3/4644 (2013.01); H01L 21/6835 (2013.01); H01L 23/49822 (2013.01); H05K 2201/09036 (2013.01);
Abstract

A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.


Find Patent Forward Citations

Loading…