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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9832399 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Jan. 29, 2016

Image sensor and method for manufacturing the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chia-Yu Wei, Tainan, TW;

Chin-Hsun Hsiao, Kaohsiung, TW;

Po-Chun Chiu, Taipei, TW;

Yu-Hsuan Cheng, New Taipei, TW;

Yung-Lung Hsu, Tainan, TW;

Hsin-Chi Chen, Tainan, TW;

Ching-Ling Cheng, Kaohsiung, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 31/062 (2012.01); H04N 5/359 (2011.01); H04N 5/374 (2011.01); H04N 5/232 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/359 (2013.01); H01L 27/1463 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01); H04N 5/23212 (2013.01); H04N 5/374 (2013.01);
Abstract

An image sensor including a substrate, a trench isolation, a plurality of image sensing units, at least one phase detection unit, and an interconnection layer is provided. The trench isolation is in the substrate, and a plurality of active areas of the substrate are separated from each other by the trench isolation. The image sensing units and the at least one phase detection unit are in the active areas arranged in an array, and a sensing area of the at least one phase detection unit is smaller than a sensing area of each of the image sensing units. The interconnection layer is disposed on the image sensing units and the at least one phase detection unit. In addition, a method of fabricating an image sensor is also provided.

Find Patent Forward Citations

Wei, Chia-Yu. (2017). Image sensor and method for manufacturing the same (U.S. Patent No. 9832399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9832399

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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