The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jul. 27, 2011
Applicants:

Alex Chi Keung Chan, Hong Kong, CN;

Charles Chak Hau Pang, Hong Kong, CN;

Inventors:

Alex Chi Keung Chan, Hong Kong, CN;

Charles Chak Hau Pang, Hong Kong, CN;

Assignee:

CREE HONG KONG LIMITED, Shatin, New Territories, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 24/73 (2013.01); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/0033 (2013.01);
Abstract

The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.


Find Patent Forward Citations

Loading…