The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Aug. 26, 2016
Disco Corporation, Tokyo, JP;
Yuta Yoshida, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A package substrate machining method is provided. The package substrate includes a ceramic substrate, a plurality of device chips arranged on one face of the ceramic substrate, and a coating layer made of a resin that covers the entire one face of the ceramic substrate. The package substrate machining method includes a first laser-machined groove formation step adapted to form, in the coating layer, first laser-machined grooves along scheduled division lines set up on the package substrate by irradiating a laser beam at a wavelength absorbable by the coating layer from the coating layer side of the package substrate; and a second laser-machined groove formation step adapted to form, in the ceramic substrate and after the first laser-machined groove formation step, second laser-machined grooves along the scheduled division lines by irradiating a laser beam from the ceramic substrate side of the package substrate.