The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Sep. 14, 2015
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Tsutomu Ina, Kiyosu, JP;

Tohru Oka, Kiyosu, JP;

Assignee:

Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/20 (2006.01); H01L 29/417 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 29/41741 (2013.01); H01L 29/513 (2013.01); H01L 29/66734 (2013.01); H01L 29/7813 (2013.01);
Abstract

A semiconductor device includes: a semiconductor layer; a first electrode that is in ohmic contact with part of the semiconductor layer; an insulating film that is formed over from the semiconductor layer to the first electrode and has an opening area on an inner side of a first edge of the first electrode; a second electrode that is located at a position different from the first electrode and is formed on at least one of the insulating film and the semiconductor layer; and a third electrode that is made of an identical component with a component of the second electrode and is formed on the first electrode through the opening area and is also formed over from the first electrode to an inner side of the first edge on the insulating film.


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