The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Sep. 01, 2016
Shinko Electric Industries Co., Ltd., Nagano, JP;
Shintaro Hayashi, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a lead frame; a semiconductor chip mounted on the lead frame; and an encapsulation resin, wherein a convexo-concave portion including a plurality of concave portions is provided at a covered portion of the lead frame that is covered by the encapsulation resin, wherein the planer shape of each of the concave portions is a circle, the diameter of which is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, or a polygon, the diameter of whose circumcircle is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, and wherein a ratio S/Sis greater than or equal to 1.7 where 'S' is a surface area of the convexo-concave portion that is formed at a flat surface whose surface area is 'S'.