The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Jan. 18, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2014.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 31/2644 (2013.01); G01R 31/2884 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01);
Abstract
A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the test element. A first wire is connected to the test element, and the first wire and the test element are part of a first layer disposed on a semiconductor substrate. A second wire is connected to the first wire, and is part of a second layer disposed on the semiconductor substrate, and the second layer is different from the first layer.