The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Mar. 13, 2014
Applicant:

Tel Fsi, Inc., Chaska, MN (US);

Inventors:

Kevin L Siefering, Excelsior, MN (US);

William P Inhofer, Plymouth, MN (US);

David DeKraker, Burnsville, MN (US);

Assignee:

TEL FSI, INC., Chaska, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G05B 19/41 (2006.01); G05B 19/418 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67075 (2013.01); G05B 19/418 (2013.01); H01L 21/31111 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01);
Abstract

A method and processing system are provided for independent temperature and hydration control for an etching solution used for treating a wafer in process chamber. The method includes circulating the etching solution in a circulation loop, maintaining the etching solution at a hydration setpoint by adding or removing water from the etching solution, maintaining the etching solution at a temperature setpoint that is below the boiling point of the etching solution in the circulation loop, and dispensing the etching solution into the process chamber for treating the wafer. In one embodiment, the dispensing includes dispensing the etching solution into a processing region proximate the wafer in the process chamber, introducing steam into an exterior region that is removed from the wafer in the process chamber, and treating the wafer with the etching solution and the steam.


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