The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Sep. 21, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Naohide Ito, Iwate, JP;

Daisuke Morisawa, Yamanashi, JP;

Keiji Osada, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); C23C 16/52 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4584 (2013.01); C23C 16/52 (2013.01); H01L 21/02263 (2013.01); H01L 21/67201 (2013.01); H01L 21/67745 (2013.01);
Abstract

Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.


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