The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Nov. 15, 2016
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Tatsuaki Denda, Nagano, JP;
Osamu Hoshino, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10545 (2013.01);
Abstract
A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.