The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Dec. 19, 2016
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Pinghui Li, Singapore, SG;

Ming Zhu, Singapore, SG;

Xinshu Cai, Singapore, SG;

Fan Zhang, Singapore, SG;

Danny Pak-Chum Shum, Singapore, SG;

Darin Chan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7885 (2013.01); H01L 23/5226 (2013.01); H01L 29/0649 (2013.01); H01L 29/0847 (2013.01); H01L 29/1083 (2013.01); H01L 29/42328 (2013.01); H01L 29/66825 (2013.01); H01L 29/7838 (2013.01);
Abstract

Integrated circuits and methods for fabricating integrated circuits with non-volatile memory structures are provided. An exemplary integrated circuit includes a semiconductor substrate having a central semiconductor-on-insulator (SOI) region between first and second non-SOI regions. The substrate includes a semiconductor base in the SOI region and the non-SOI regions, an insulator layer overlying the semiconductor base in the SOI region, and an upper semiconductor layer overlying the insulator layer in the SOI region. The integrated circuit further includes a first conductivity type well formed in the base in the first region and in a first portion of the SOI region, and a second conductivity type well formed in the base in the second region and in a second portion of the SOI region lateral of the first conductivity type well. Also, the integrated circuit includes a non-volatile memory device structure overlying the upper semiconductor layer in the SOI region.


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