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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9824993 B1

PDFFull Text
Date of Patent:
Nov. 21, 2017

Filed:

Jul. 06, 2016

Packaging structure

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Sumihiro Ichikawa, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Syed Gheyas

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 23/49833 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81193 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/14 (2013.01);
Abstract

A packaging structure includes a first substrate including a first metal terminal and a first protruding resin portion formed at a first surface; a second substrate including a second metal terminal and a second protruding resin portion formed at a second surface, the second metal terminal being made of the same kind of metal as the first metal terminal; and a sealing portion filled between the first surface of the first substrate and the second surface of the second substrate, the first metal terminal and the second metal terminal being directly bonded with each other, the first protruding resin portion and the second protruding resin portion being directly bonded with each other, each of the first protruding resin portion and the second protruding resin portion being made of a resin material that does not include fillers, and the sealing portion being made of a resin material including fillers.

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