The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
Mar. 23, 2016
Texas Instruments Incorporated, Dallas, TX (US);
Dolores Babaran Milo, Baguio, PH;
Mark Gerald Rosario Pinlac, Angeles, PH;
Bobby Johns Lansangan Villacarlos, Cabuyao, PH;
Jerry Gomez Cayabyab, Baguio, PH;
Juan Carlo Aro Rimando, La Trinidad, PH;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A semiconductor device having a leadframe including a pad () surrounded by elongated leads () spaced from the pad by a gap () and extending to a frame, the pad and the leads having a first thickness () and a first and an opposite and parallel second surface; the leads having a first portion () of first thickness near the gap and a second portion () of first thickness near the frame, and a zone () of reduced second thickness () between the first and second portions; the second surface () of the first lead portions is coplanar with the second surface () of the second portions. A semiconductor chip () with a terminal is attached the pad. A metallic wire connection () from the terminal to an adjacent lead includes a stitch bond () attached to the first surface of the lead.