The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Jun. 11, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

Kevin S. Petrarca, Newburgh, NY (US);

Nicholas A. Polomoff, White Plains, NY (US);

Katsuyuki Sakuma, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/563 (2013.01); H01L 2021/6009 (2013.01);
Abstract

Alignment marks on a semiconductor device surface are exposed and exposed surfaces cleaned after an obscuring coating is applied over the surface and marks. The surface can be an attachment surface of the device and can include C4 solder bumps of a flip-chip type device and the coating can include a wafer level underfill coating that is substantially optically opaque. Laser ablation, such as with a UV laser, can remove the coating while minimizing heat transfer to the device.


Find Patent Forward Citations

Farooq, Mukta. (2017). Flip chip alignment mark exposing method enabling wafer level underfill (U.S. Patent No. 9824925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9824925

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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